Apple iPhone 7/iPhone 7 Plus BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation
QianLi 3D BGA Reballing Gold Stencil For iPhone 7/7 Plus
€11.02
Beschikbaarheid: Out of stock
Keer terug binnen 30 dagen van aankoop. Belastingen worden niet terugbetaald.
Veilig en betrouwbaar afrekenen
| Product Type | BGA Chip Ball Template Stencil |
|---|---|
| Group brand | Repair Tools |
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